Technical Capabilities
Printed Circuit Boards Manufacturing
SR SPECIFICATIONS VALUE
1. Max. no. of layers 24
2. Max. board size (L x W) in mm. 415 x 565
3. Max. board thickness (in mm.) 3.20 mm
4. Min. finished board thickness (in mm.) 0.40 mm (No HAL)
Base Material
SR SPECIFICATIONS VALUE
1. Base Material FR4
2. Inner layer Copper cladding
* Max. Cu Wt. For Planes (Oz.) 2
* Max. Cu Wt. For Signals (Oz.) 2
* Min. Cu Wt. (Oz.) 0.5
3. Outer layer Copper cladding
*Max Cu Wt. (Oz.) 3
*Min Cu Wt. (Oz.) 0.5
Circuit Layers (Minimum capabilities in mm)
SR SPECIFICATION VALUE
For Start copper thickness of 0.5 Oz. Min track width 0.125 mm Min. Spacing 0.125 mm
For Start copper thickness of 1.0 Oz. Min track width 0.15 Min. Spacing 0.15
For Start copper thickness of 2.0 Oz. Min track width 0.175
Min. Spacing 0.2
Circuit Layers (Minimum capabilities in mm)
SR SPECIFICATION VALUE
For Start copper thickness of 0.5 Oz. Min track width 0.125 mm Min. Spacing 0.125 mm
For Start copper thickness of 1.0 Oz. Min track width 0.15 Min. Spacing 0.15
For Start copper thickness of 2.0 Oz. Min track width 0.175 Min. Spacing 0.2
Drilling
SR SPECIFICATION VALUE
1. Min. finished via hole size (Tool dia) 0.25 mm
2. Min. finished via pad size 0.5 mm
3. Min. annular ring 0.125 mm
4. Drill to drill clearance 0.15 mm
5. Min. slot size for PTH slots (Tool size) 0.80 mm
6. Blind & Buried vias manufacturable YES
7. Drill to track clearance for Inner layers (upto 6 layer) 0.275 mm
Drill to track clearance for Inner layers (>6 layer) 0.35 mm
8. Min. drill size for plated holes on board edge 0.80 mm
9. Min. drill to drill clearance for plated holes on board edge 0.80 mm
10. Any special angle for Counter sunk Not Possible
Surface Finish
SR SPECIFICATION VALUE
1. HASL (Lead free & PB/Sn both) YES
2. Electrolytic Gold YES
3. Electroless Nickle / Gold YES
4. Immersion Silver YES
5. Immersion Tin YES
6. SMOBC with OSP YES
7. Selective Gold Not Possible
Layer construction & Impedance Design
SR SPECIFICATION VALUE
1. Min. core thickness 0.15 mm
2. Min. possible dielectric thickness 0.15 mm
3. Sequential buildup Not Possible
4. Controlled Impedance merasurement YES
Solder Mask
SR SPECIFICATION VALUE
1. Mask opening Green masking 0.10 mm
2. Min. soldermask web width between pads 0.10 mm
3. Mask opening Other than Green 0.120 mm
4. Min. soldermask web width between pads 0.120 mm
5. SM to trace clearance 0.10 mm
6. Via fill max drill size 0.40 mm
Legend
SR SPECIFICATION VALUE
1. Legend line width 0.15 mm to 0.20 mm
2. Min. character height 1.00 mm
Scoring
SR SPECIFICATION VALUE
1. Angle for v-cut 30 degree
2. Jump scoring Yes
Routing
SR SPECIFICATION VALUE
1. Min. router size 0.80 mm
2. Depth routing Not possible
3. Any special tolerances for Chamfering Not possible
Copper Clearance from PCB Edge
SR SPECIFICATION VALUE
1. For routing 0.25 mm
2. For scoring 0.45 mm
3. For inner layer 0.4 mm
Carbon
SR SPECIFICATION VALUE
1. Min. line width 0.30 mm
2. Min. carbon – carbon spacing 0.25 mm
Peelable
SR SPECIFICATION VALUE
1. Minimum width of any Peel-off element 0.50 mm
2. Maximum coverable hole ENDSIZE 6.00 mm
3. Minimum overlap on copper pattern 0.254 mm
4. Minimum clearance to free copper 0.254 mm
5. Minimum distance from PCB outline 0.50 mm
Drill Tolerances
PTH HOLE SIZE PTH TOLERANCE NPTH HOLE SIZE NPTH TOLERANCE
0.50-3.50 mm +/- 0.10 mm <3 mm +/- 0.10 mm
>3.50 mm +/- 0.15mm >3 mm +/- 0.15 mm
Other Tolerances
PCB Size +/- 0.20 mm
PCB Thickness +/- 0.10 %
Trace Width / Spacing +/- 0.20 %
Copper Thickness Inside Hole >= 0.20 um
Bow & twist tolerance +/- 1%
Available Finishes
ROHS Compliances finishes :
⦁ Lead Free HAL
⦁ Immersion Tin
⦁ Electroless Nickel Immerssion Gold (0.075-0.1 um AU + 3-5 um Ni)
⦁ OSP
Non-ROHS Finish :
⦁ HAL(sn PB)
Solder Mask Colours
⦁ Green
⦁ Black
⦁ White
⦁ Blue
⦁ Red
Legend Colours
⦁ White
⦁ Black
⦁ Yellow
Special Technologies
⦁ Impedance Control
⦁ Blind / Buried Vias
⦁ Carbon Printing
⦁ Hard Gold Tabs
⦁ Peelable Sodler Mask